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Low Thermal Inpedance 9W/MK Silicone Thermal Conductive Gel For Vehicle Engine Control
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Brand Name:ZIITEK
Model Number:TIF090-11
Certification:UL and RoHs
Price:negotiation
Supply Ability:10000/day
Delivery Time:7-15work days
Company Data
Verified Supplier
Contact Person
Dana Dai
Business Type:
Manufacturer
Officials:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Quality:
Quality Certifitation Available
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Product Details
Company Profile
Product Details
Low Thermal Inpedance 9W/MK Silicone Thermal Congductive Gel For Vihicel Enginee Controler
Company Profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
TIF®090-11 is a soft silicone-based gap filler pad formulated with thermally conductive fillers and a unique compound that combines excellent themal performance with outstanding softness. Compared to conventional thermal grease,TIF®090-11 has a higher viscosity, effectively preventing the separation of fllers from the siliconebase. lt also offers more stable bond line control under pressure,enhancing product reliability. TIF®090-11 is applied similaty to traditional themal paste and is compatible with various commercial equipment,such as dispensing systems or automated production equipment. lt is suitable for a wide range of high-power electronic components and packaging formats, including flip-chip microprocessors (Flip-Chip MPU),PPGA, micro BGA,BGA,DSP chips, circular accelerator chips, and LED lighting modules.
Feature
> Thermal conductivity: 9.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
> Proven long-term reliability
Application
> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler
> Telecom industry
> Semiconductor automatic laboratory equipment
| TIFTM090-11 Typical Property | ||
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicon material | ***** |
| Viscosity | 13000K mPa.s | GB/T 10247 |
| Specific Gravity | 3.45g/cm³ | ASTM D297 |
| Thermal conductivity | 9.0 W/mK | ASTM D5470 |
| Thermal resistance @10Psi(℃-in²/W) | 0.089 | ASTM D5470 |
| Thermal resistance @50Psi(℃-in²/W) | 0.055 | ASTM D5470 |
| Recommended Operating temp | -45~200℃ | ISO 22007-2 |
| Dielectric breakdown strength(V/mm) | ≥4000 | ISO 22007-2 |
| Bond line Thickness | 0.4 | ****** |
| D3-D10(Siloxane Content, ppm) | ＜100 | GC-MS |
| Flame Rating | V-0 | UL 94 |
Packing details
30 cc/pc, 98 pc/box;
300 cc/pc , 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.
Please contact us for confirming.
Independent R&D team
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Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Company Profile
Dongguan Ziitek Electronic Materials & Technology Ltd.
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Ziitek D-U-N-S® Number: 656191068
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