China Categories
Heat Sinking Heat Conductivity Materials , Thermally Conductive Filler Perfect Performance
Ask Latest Price
Brand Name:ZIITEK
Model Number:TIF360
Certification:UL and RoHs
Price:negotiation
Supply Ability:10000/day
Delivery Time:3-5work days
Company Data
Verified Supplier
Contact Person
Dana Dai
Business Type:
Manufacturer
Officials:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Quality:
Quality Certifitation Available
Visit Website
Product Details
Company Profile
Product Details
Heat Sinking Heat Conductivity Materials , Thermally Conductive Filler Perfect Performance
The TIF360 is a silicone based, thermally conductive gap pad. Its unreinforced
construction allows additional compliancy. This product has low
hardness is conformable and is electrically isolating. The low
modulus characteristic of the product offers optimal thermal
performance with the ease of handling
Features:
> Good thermal conductive: 2.8 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications:
> RDRAM memory modules
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
Typical Properties of TIF™360 | ||||
Color | gray | Visual | Composite Thickness | hermalImpedance @10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.21 |
| 20mils / 0.508 mm | 0.27 | |||
Specific Gravity | 2.41 g /cc | ASTM D297 | 30mils / 0.762 mm | 0.39 |
40mils / 1.016 mm | 0.43 | |||
Heat Capacity | 1 l /g-K | ASTM C351 | 50mils / 1.270 mm | 0.50 |
60mils / 1.524 mm | 0.58 | |||
Hardness | 27 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.65 |
80mils / 2.032 mm | 0.76 | |||
Tensile Strength | 40 psi | ASTM D412 | 90mils / 2.286 mm | 0.85 |
100mils / 2.540 mm | 0.94 | |||
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 1.00 |
120mils / 3.048 mm | 1.07 | |||
Dielectric Breakdown Voltage | >1500～>5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.16 |
140mils / 3.556 mm | 1.25 | |||
Dielectric Constant | 5.5 MHz | ASTM D150 | 150mils / 3.810 mm | 1.31 |
160mils / 4.064 mm | 1.38 | |||
Volume Resistivity | 6.3X1012Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.43 |
180mils / 4.572 mm | 1.50 | |||
Fire rating | 94 V-0 | equivalent UL | 190mils / 4.826 mm | 1.60 |
200mils / 5.080 mm | 1.72 | |||
Thermal conductivity | 2.8 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Dongguan Ziitek Electronic Materials & Technology Ltd.
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Ziitek D-U-N-S® Number: 656191068
Send your message to this supplier
You May Like
Thermal Silicone Foam Rubber Yellow Soft Compressible 2.0 W/M-K Thermal Gap Filler For Cooling Components / LED TV
Blue Soft Thermal Gap Filler 1.5w / Mk For Automotive Engine Control Units UL RoHs
Handheld Portable Electronics high Thermal Gap Filler 4.0W/mK , grey thermal silicone rubber pad 5.5 MHz
Telecommunication Hardware blue 5.0W/mK Thermal Gap Filler Materials 2.75 g/cc, thermal silicone rubber pad 45 shore00
Green 2.0 W/mK Thermal Gap Filler TIF180-20-07E 2.032 mm Silicone rubber sheet in 35shore00 hardness
CPU High Thermal Conductivity Silicone CE for RDRAM memory modules Gray with 1 l / g -K Heat Capacity
Ultra Thin Adhesive Thermal Gap Filler For LCD Led TV / Lamps Compressible for Telecommunication hardware and LED light
5 W / mK blue-violet Thermal Silicone rubber pad thermal Gap Filler with 50 shore00 for Micro Heat Pipe -50 to 200℃
Blue Heatsink Cooling Thermally Gap Filler 2.0W/mK Ultrasoft Low Thermal Resistance silicone rubber pad 45 shore00
Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00 -50 to 200℃
2.0W/mK PINK High Voltage Isolation Thermal Gap Filler, TIF100-20-15S Cooling Heatsink 45 Shore 00 -50 to 200℃
Inquiry Cart
0