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Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module
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Brand Name:ZIITEK
Model Number:TIF050-11
Certification:UL and RoHs
Price:negotiation
Supply Ability:10000/day
Delivery Time:7-15work days
Company Data
Verified Supplier
Contact Person
Dana Dai
Business Type:
Manufacturer
Officials:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Quality:
Quality Certifitation Available
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Product Details
Company Profile
Product Details
Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module
TIF050-11 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF050-11 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF050-11 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF050-11 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .
TIF050-11 Series Datasheet-REV02.pdf
Application
>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe ,Vihicel enginee controler
>Telecom industry
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
Feature
>Thermal conductivity: 5W/mK
>Soft, very low compression
>Operate automaticly
>Soft and Compressible for low stress applications
| TIFTM050-11 Property | |||
| Color | Gray | Visual | |
| Construction & Composition | Ceramic filled silicon material | ********** | |
| Viscosity | 2000,000cps | GB/T 10247 | |
| Specific Gravity | 3.05 g/cc | ASTM D297 | |
| Thermal conductivity | 5.0 W/mK | ISO 22007-2 | |
| Thermal diffusivity | 1.695 mm2/s | ISO 22007-2 | |
| Specific heat capacity | 2.3 MJ/m3K | ISO 22007-2 | |
| Continuous Use Temperature | -45 ~200°C | ****** | |
| Dielectric breakdown strength | 200 V/mil | ASTM D149 | |
| Flame Rating | 94V0 | E331100 | |
| Outgassing,%TML | 0.60% | ASTM E595 | |
Package :
•30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.
Company Profile
Dongguan Ziitek Electronic Materials & Technology Ltd.
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Ziitek D-U-N-S® Number: 656191068
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