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New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone

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Buy cheap New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK from wholesalers
  • Buy cheap New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK from wholesalers
  • Buy cheap New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK from wholesalers

New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

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Brand Name:ZIITEK
Model Number:TIF035-05
Certification:UL and RoHs
Price:negotiation
Supply Ability:10000/day
Delivery Time:3-5work days
Company Data
Verified Supplier
Contact Person Dana Dai
Business Type: Manufacturer
Officials: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, 523460 Dongguan City
Quality: Quality Certifitation Available
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Product Details Company Profile
Product Details

New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

TIF035-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF035-05 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF035-05 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF100-35 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .


TIF035-05 Series Datasheet-REV02.pdf


Application


>Heat-sink & frame

>LED backlight module,LED lighting

>High speed hardware driver

>Micro heat pipe ,Vihicel enginee controler

>Telecom industry


Feature


>Thermal conductivity: 3.5W/mK

>Soft, very low compression

>Operate automaticly


TIF035-05 Property
ColorBlueVisual
Construction & CompositionCeramic filled silicon material**********
Viscosity2000,000cpsGB/T 10247
Specific Gravity3.0 g/ccASTM D297
Thermal conductivity3.5 W/mKISO 22007-2
Thermal diffusivity1.1073 mm2/sISO 22007-2
Specific heat capacity3.3 MJ/m3KISO 22007-2
Continuous Use Temperature-45 ~200°C******
Dielectric breakdown strength200 V/milASTM D149
Flame Rating94V0E331100
Outgassing,%TML0.80%ASTM E595

Package :


Product Specification:

•30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.


New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Why Choose us ?


1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Company Profile

Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.  

 

Ziitek D-U-N-S® Number: 656191068

 

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